Tuesday, March 3, 2009
RF SoP Co-design
This month's lead story in Microwave Journal looks at the state of System on Package technology as package device features move to the nano-scale. With such high density, the co-design of RF System on Package (SoP) is an evolving concern among multi-chip module manufacturers and the EDA companies that support this complex technology. Our editors posed a number of related questions to AWR, Agilent and Mentor Graphics on co-design, simulation and design flows for multi-chip modules and advanced packaging. The following MWJ exclusives take a look at this evolution.
Mentor Graphics:EDA/RF SoP Co-Design>
Agilent:EDA/RF SoP Co-Design>
AWR:EDA/RF SoP Co-Design>