The Fifth Annual Device Packaging Conference (DPC2009) will be held in Scottsdale, Arizona, on March 9-12, 2009. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS). The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3D Packaging; Flip Chip; Wafer Level Packaging; MEMS; BioMedical Devices; and Power LED Devices. While the majority of technical sessions seem to be focused on fabrication, reliability and thermal issues (i.e. Impact of Underfill Design on Package Reliability), advanced packaging technology certainly impacts multi-chip manufacturers. A couple of talks from the technical sessions caught my eye, including:
Tunable Millimeter-Wave Device Based on Waveguide-Packaged MEMS
Compact Square Patch Antenna for Mobile Application
In the poster sessions, look for:
RF and Thermal Analysis of Packaged TGA4046 Q Band Amplifier
Design of Tunable Filter Structures using Multilayer Low Temperature Cofired Ceramics (LTCC)
A Unique Process for Hermetic Wafer Level Packaging
The full conference and exhibition information is at:
http://www.imaps.org/devicepackaging
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