Well, it took no time at all for someone to crack open the new iPhone 3G and see what chips are inside. iFixit.com got one in the first major time zone for it to go on sale (New Zealand) and dissected it immediately (http://live.ifixit.com/images/XiuvbfUecK3GsDUm-large.jpg). Infineon with 4 chips and Triquint with 3 chips were the clear winners here. Skyworks had one chip, a quad band amplifier module which I think they also had a similar part in the first generation iPhone. Triquint has 3 amplifier modules that include an input filter, linear amplifier, duplexer and coupler. Infineon has the GPS, digital baseband processor, UMTS transceiver and power management IC. This should be a good boost for Triquint and Infineon is already a major player in these areas but it will be good PR for them also.
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